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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

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    Available in PDF Format | Design for High Performance, Low Power, and Reliable 3D Integrated Circuits.pdf | Unknown
    Sung Kyu Lim
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous ?manufacturing-ready? GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.  
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*An electronic version of a printed book that can be read on a computer or handheld device designed specifically for this purpose.

Formats for this Ebook

PDF
Required Software Any PDF Reader, Apple Preview
Supported Devices Windows PC/PocketPC, Mac OS, Linux OS, Apple iPhone/iPod Touch.
# of Devices Unlimited
Flowing Text / Pages Pages
Printable? Yes

Book details

  • PDF | 590 pages
  • Sung Kyu Lim
  • Springer
  • Unknown
  • 6
  • Computers Technology
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